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LTC3230
PACKAGE DESCRIPTION
UD Package
20-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1720 Rev A)
0.70 ± 0.05
3.50 ± 0.05
(4 SIDES)
1.65 ± 0.05
2.10 ± 0.05
PACKAGE
OUTLINE
0.20 ± 0.05
0.40 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
BOTTOM VIEW—EXPOSED PAD
PIN 1 NOTCH
R = 0.20 TYP
3.00 ± 0.10
(4 SIDES)
PIN 1
TOP MARK
(NOTE 6)
0.75 ± 0.05
R = 0.05
TYP
R = 0.115
TYP
19 20
OR 0.25 × 45 °
CHAMFER
0.40 ± 0.10
1
2
1.65 ± 0.10
(4-SIDES)
(UD20) QFN 0306 REV A
0.200 REF
0.00 – 0.05
0.20 ± 0.05
0.40 BSC
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
3230fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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